Chief Technology Officer and Vice President Engineering, Appliances BU
TE Connectivity provides engineered electronic components, network solutions, specialty products, and undersea telecommunication
Accomplished Engineering executive with demonstrated success in end to end product lifecycle management Strong R&D and business background with a passion for design and a record of value creation through innovation and new technology adoption focused on delivering great customer experiences A passionate leader with a proven track record in building and leading global teams (US, China, EU, Taiwan) comprising engineering, project management and quality functions to successfully deliver complex, innovative product portfolios to market Ability to lead and manage product development life cycle, technology and IP, regulatory approvals, transfer to production, and support of multiple product lines for consumer and business markets. Successful in ability to combine hardware, software, and new technologies into unique solutions that generate both valued experiences for consumers and long term enterprise value for the business Recognized for ability to effectively drive results by creating strong relationships both internally with product and executive management and externally with technology, service and manufacturing partners Ability to consistently launch complex portfolios of consumer electronic products into high volume production with ODM, JDM and EMS partners An effective change agent with strengths in optimizing organizational efficiency and performance, with a focus on quality and customer experience while driving aggressive cost targets and shorter development cycles. Ability to design and apply appropriate processes and standards to portfolio management, product definition, design, test and qualification activities Adaptability in face of changing business or engineering challenges, applying risk management tools and comprehensive mitigation strategies as appropriate Proven strength in leading Industrial design, UX, EE, RF, mechanical eng and materials science, embedded F/W, application S/W, validation and design for test and high volume manufacturing
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