Ashish Vora Email Address

Director Product Engineering, Operations and New Product Introduction

InvenSense is the world's leading provider of MEMS-based motion processing products for handheld consumer electronics devices and is dedicated to bringing the best-in-class size, performance and cost solutions to market. Targeting applications in game controllers, mobile handsets, digital still and video cameras, 3D remote controls/mice, and portable navigation devices, InvenSense technology brings about the next-generation of motion processing based on its advanced multi-axis gyroscope technology. Motion processing is quickly becoming the next must have" function in handheld devices requiring a true 1:1 interactive user interface versus current motion sensing technology using 3-axis accelerometer or magnetic sensors. InvenSense has pioneered innovations in MEMS design and fabrication based on its patented and silicon hardened Nasiri-Fabrication, delivering the world's first integrated dual-axis gyroscope (IDGTM) which overcomes the major challenges for adoption into handheld consumer products-size, price/performance, and robust shock tolerance. Integration of MEMS and signal compensation electronics at the wafer level that achieves complete hermeticity is the key enabling technology to produce complex and advanced motion processing products. Founded in 2003, InvenSense is based in Sunnyvale, California, with test operations in Taiwan and sales and applications support offices in Taiwan and Japan. Key Investors include Artiman Ventures, Partech International, Sierra Ventures, and Qualcomm Ventures, and strategic investors, Foxconn, Inventec Appliances Corporation, VentureTech Alliance, Skylake Ventures, and DoCoMo Capital."

As NPI Product/Test Engineer: 1) NPI Project Lead for company's flagship 2-Axes, 3-Axes and 6-Axes product families. Successfully released more than 10 products to MP. 2) EPM and planning working in New Product Introduction team focused on new Product Development. 3) Material planning and sample delivery 4) Lead new products from Engineering through ramp up to mass production. 5) Testing and characterization. 6) Yield Analysis and Improvement 7) Failure Analysis 8) Packing development 9) Customer Support. As Applications Engineer: 1) Design and develop evaluation / customer demo boards for High Speed High resolution (10-16 bit) ADCs. 2) Customer support activities, answering customer queries, debugging customer setups. 4) Complete Evaluation and validation of silicon during development. 5) Developing characterization plans for silicon validation. 6) Creating datasheets and other technical documentation. As Test Engineer: 1) Successfully released various high speed / high resolution ADCs to production. 2) Develop package and wafer sort test solutions. 3) Creating and implementing a test plan to ensure that new products meet specifications with adequate test coverage as well as to enhance wafer sort and final test yield while reducing test time. 4) Develop characterization plans and the characterization program. Perform Multi temperature characterization. 5) Develop hardware (Printed circuit board - PCB) using Cadence Allegro and Orcad to achieve high precision and high speed measurements on ATE and write software (test program) to work with Automatic Test Equipment (ATE). 6) Program ATE (Teradyne) for testing ADCs. 7) Develop all documentation to describe test procedures and test methods and release the entire test package (H/W and S/W into production. 9) Train production personnel on all sustaining activities related to the test system. 9) Failure analysis. 10) Work with teams from different locations worldwide in Melacca (Malaysia), India and USA. Specialties: 6+ years of Product / Test Engineering experience 3+ years of NPI experience. Engineering Project Management and Planning. Product development, testing and characterization. Yield Improvement High Speed PCB Design and debug. MEMS Sensor packaging, testing, characterization, validation. High Speed Analog-to-Digital Convertor (ADC) Testing. Preparing Data sheets and other technical documentation. Mixed Signal test and application. Experience with Teradyne CATALYST, Flex and NI's PXI platform.